TPS2065CDBVR Wave Soldering Profile
========== QUESTION ==========
Posted by Ivy Ong
on Feb 22 2012 03:16 AM
Hi,
Can you share with me the Wave/Flow Soldering Profile for TPS2065CDBVR (SOT23).
Or is there any link that I can download the profile from?
Thanks
========== ANSWER ==========
Posted by Martin Patoka
on Feb 23 2012 07:42 AM
The DBV package is qualified for reflow according J-STD-020 standard for maximum 260°C reflow temperature on the package, with a slow preheating to this temperature. Commonly a full convection reflow oven is used for this process.
Using the TPS2065CDBVR in a wave solder process (bottom-side mounted, and immersed in solder wave) is not qualified by TI and is at the customer's risk. The reason is that the package sees a thermal shock when the board moves from the preheating stage (around 150-180°C) into the liquid solder wave which may exceed 260°C for leadfree soldering. A part mounted to the topside (not in the solder) during wave will be OK with normal process temperatures..
There is not a specific profile recommended if the part is subjected to wave soldering. It usually is dependent on the equipment settings and structure. The solder and flux suppliers involved in that process may have general recommendations.
For reflow soldering, using SnAgCu leadfree solder pastes, the solder paste supplier recommendation is the first step to consider. Usually the peak temperature for reflow soldering is somewhere in the 235-245°C range to form the solder joint. This depends on the variations of packages on the board. Small packages may get hotter than larger ones during the reflow pass.
