========== Question ==========
Posted by Satyaprakash R1
I have query regarding manufacturing process for few parts.
| TPS61170DRVR |
| CLVC1G125MDCKREP |
| CD74HC125QPWRQ1 |
| SN74AHC1G04QDBVRQ1 |
1. Please let me know the reflow parameters specification or do you follow the J-STD-020 standard or any other standard.
2. What kind of reflow solder process is allowed? ( for example Hot Air/Convection, IR , Vapor Phase, )
3. Is wave soldering is allowed for these parts?
4. What kind of flux is used for example rosin, resin, Organic, Inorganic etc,
5. What kind of rework is preferred for example hand, Hot air, etc and its peak temperature.
6. We would also like to know the recommended method for cleaning. For example Water, Alcohol any other
If you any proper document for manufacturing/Assembly process please provide me that.
Here by I am attaching spread sheet where choices for each fields are noted in comments.
========== Answer ==========
Posted by JohnTucker
In general we follow J-STD-020. The maximum allowed reflow temperature is stated on the Moisture Sensitivity Label (MSL).
John Tucker
Consumer DC/DC Applications
Consumer DC/DC Applications
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