2007년 3월 30일 금요일

Fwd: [microblaze-uclinux] RTLinux beta release


--------------- Original message -------------
From : "Alejandro Lucero"<alucero@os3sl.com>
To : <microblaze-uclinux@itee.uq.edu.au>
CC :
Date : Sat, 24 Mar 2007 2:36:56 +0900 (KST), Fri, 23 Mar 2007 18:30:40 +0100
Subject : [microblaze-uclinux] RTLinux beta release

Hello,

I'm glad to announce a RTLinux beta release for uClinux/microblaze. This has
been delayed since I'm doing it in my spare time since the official financed
project was finished.

This release has some drawbacks as no floating point support, no debugger and
no smp. The RTLinux patch for uClinux has been tested with uClinux
distribution for Microblaze sources downloaded last December.

You can download the code and some docs at:

http://www.os3sl.com/microblaze_rtlinux.html

I hope people interested in this work help me to improve the documentation
available and report experience working with this software and, of course,
report any problem to this email.

Thank you.

--
Alejandro Lucero
Director T?nico
+34 665 68 71 68
Valencia (SPAIN)
www.os3sl.com

___________________________
microblaze-uclinux mailing list
microblaze-uclinux@itee.uq.edu.au
Project Home Page : http://www.itee.uq.edu.au/~jwilliams/mblaze-uclinux
Mailing List Archive : http://www.itee.uq.edu.au/~listarch/microblaze-uclinux/


--

-- / Chang-woo YANG / ---------------------------
------------ http://www.PLDWorld.com ------------
------------------------------------ oOOo oOOo --

2007년 3월 21일 수요일

전자 메일 보내기: Nios II Software Help

Original Page

Page URL: http://www.altera.com/support/ip/processors/nios2/ide/ips-nios2-ide-tutorial.html


Nios II Software Help

GNU Tools Source Files

Nios II IDE Online Help

The Nios II Integrated Development Environment (IDE) provides a searchable, indexed online help system that covers all IDE-related topics. The online help also includes tutorials and FAQs. These help topics are accessible once you install the Nios II embedded processor development tools. The online help is also available in PDF format on the Nios II Literature page.

Tutorials

The Nios II IDE Quick-Start Tutorial:

  • Teaches you how to create, build, and run Nios II software code on a target board
  • Demonstrates the quickest way to create and run a software application

To start the Nios II IDE Quick-Start Tutorial:

  1. Launch the Nios II IDE from the Start Menu or from the System Generation tab in SOPC Builder
  2. Choose Help > Cheat Sheets...
  3. Click Nios II Quick-Start Tutorial
  4. Click OK

The Nios II Software Development Tutorial:

  • Teaches you how to create, build, run, and debug Nios II software code on a target board
  • Provides you with the information needed to create and build a C/C++ application project and its corresponding system library project
  • Explains the various options available and shows you how to edit project properties

To access the tutorial:

  1. Launch the Nios II IDE from the Start Menu or from the System Generation tab in SOPC Builder.
  2. On the Nios II IDE Welcome Page, select the link for the Nios II Software Development Tutorial.

In addition, you can use the following related tutorial on using software components with Nios II processors:

FAQs and Troubleshooting Tips

The IDE includes FAQs and troubleshooting tips that provide information to assist you in developing Nios II software.

To access the FAQs and troubleshooting tips in the IDE:

  1. Select Help Contents from the Help menu.
  2. Select FAQ and Trouble Shooting under Nios II IDE Help -> Reference.

2007년 1월 24일 수요일

Power MOSFET 적용 예가 정리된 곳 (WISDOM Technologies International)

WISDOM Technologies International
 
 
화면 좌측 sub-menu를 클릭하면 관련 적용 block diagram을 확인가능...

2007년 1월 19일 금요일

정보통신 접근성 향상 표준화 포럼

 

CSS Design Korea

CSS Design Korea

  • 이름: CSS Design Korea
  • 개설일: 2005년 4월
  • URL: http://standardmag.org
  • 소개: CDK는 거의 유일한 국내의 웹 표준 관련 커뮤니티 입니다. 웹 표준과 웹 접근성 그리고 관련된 여러가지 주제들을 다루고 있습니다. 포럼을 통해 커뮤니케이션을 형성하고, 위키를 통해 각종 문서 정리 및 모임 추진을 하고 있습니다.

2007년 1월 16일 화요일

Emailing: 수익성 높은 새로운 디자인의 아이팟 나노 모델

뉴스 및 동향

수익성 높은 새로운 디자인의 아이팟 나노 모델
게재: 2007년 01월 04일

By David Carey
President
Portelligent Inc.

Apple사는 2세대 아이팟 나노를 내놓으면서 자사의 인기 있는 플래시 기반 뮤직 플레이어의 디자인을 바꿨다. 전체 아이팟 제품 라인의 중간에 위치하고 있는 2세대 나노는 2기가바이트, 4기가바이트 및 8기가바이트 용량의 모델이 제공되는데, 이들은 각각 500곡, 1,000곡 및 2,000곡 정도의 노래를 저장할 수 있는 용량에 해당한다.

2세대 제품에서 달라진 것은 무엇일까? 가장 눈에 띄는 요소들로부터 시작하자면, Apple사는 케이스 디자인을 재구성하여 스테인리스제 통과 플라스틱제 프론트 케이스의 2부분으로 되어 있던 방식을 버리고 양극화 알루미늄 쉘 하나로 된 형태를 채택했다. 이 새로운 알루미늄 몸체 속에 전자 장치들이 빽빽하게 들어차 있다. 케이스 끝의 캡 부분들을 떼어낸 뒤 (아주 작은) 나사 몇 개를 풀어내면 핵심 전자 장치들을 케이스 통의 한쪽 끝으로부터 끄집어 낼 수 있다.

케이스의 대략적인 구조는 지금은 단종된 Apple사의 아이팟 미니로부터 빌려온 것이다. 마이크로드라이브 기반의 아이팟 미니는 상대적으로 상당히 큰 케이스를 필요로 했으며 전자 패킹도 2세대 나노 모델에서 볼 수 있는 집적도 수준에 미치지 못했지만, 기술 자체는 유사하다. 보호용의 끝 부분 캡을 제외하고는 미니의 경우와 마찬가지로, LCD(이 경우에는 176x132 픽셀의 TFT 디스플레이)를 위한 투명한 아크릴 윈도와 스크롤휠 방식의 어셈블리가 케이스 표면의 연속성을 깨는 유일한 부분들이다.

PortalPlayer와의 차이점

Apple사에서는 기계 재설계와 함께 이 제품의 공급 체인도 크게 변경했지만, 선택된 설계 요소들은 상당 부분 그대로 놔두었다. PortalPlayer를 코어 미디어 프로세서로서 사용하지 않게 된 것이 아마도 가장 큰 변화일 것이다.

Apple 라벨이 붙은 ASIC인 S5L870-B05는 삼성의 제품으로서 모든 오디오 및 스틸 이미지의 디코딩을 맡고 있다. 나노 모델의 CPU에 Apple사의 독점 마킹이 찍혀 있긴 하지만, 라벨을 볼 때 이 삼성 칩 내에 ARM 코어가 탑재되어 있음을 알 수 있다. 6밀리 x 6밀리 이하 크기의 이 다이는 PortalPlayer를 기반으로 하는 나노 모델의 이전 제품과 유사한 언더필 방식의 BGA 패키지로 되어 있다. 그러나 SST사의 별도 NAND 컨트롤러 구성요소를 갖추고 있던 1세대 디자인과는 달리, 이 삼성 CPU는 NAND 인터페이스를 직접 통합시킴으로써 비용과 복잡성을 줄인 것같다.

이 삼성 프로세서는 1메가바이트의 SST 플래시를 코드 일부나 전체를 저장하는 데 사용하고 있으며, Qimonda 32메가바이트 SDRAM이 시스템의 동작 메모리를 제공하는 것은 물론 어쩌면 NAND 플래시로부터 꺼내온 노래 데이터를 위한 버퍼 역할까지도 하고 있는 것같다. 다른 2세대 나노 모델들에 대한 검사 자료를 토대로, 삼성은 32메가바이트 SDRAM의 공급업체로 알려져 있다.

첫번째 나노 모델로부터 이어져 내려온 디자인 요소들 가운데는 Cypress사의 스크롤 휠 컨트롤러(CY8C21001A)와 전력관리용으로 수정된 NXP 칩(PCF50635)이 있다. 역시 오리지널 나노 모델로부터 수정된 Wolfson사의 부품(WM8750S)은 오디오 코덱 및 헤드폰 앰프용으로 선택되어 있다. 후자의 두 부분들은 삼성의 미디어 CPU와 같이 Apple사 고유 라벨이 찍혀 있는데, 이는 아마도 공급체인을 식별하기 힘들게 하려는 시도인 것같다.

보다 명백하게 마킹 되어 있는 다른 전력관리 부품들 가운데는 National Semiconductor사의 DC/DC 컨버터(LM34910B)와 Linear Technology사의 LTC4066(이것은 나노 모델의 USB 인터페이스를 통해 2.2밀리 x 33밀리 x 55밀리 크기의 웨이퍼 형 폴리머 배터리를 충전한다)이 있다.

배터리 자체는 표준 싱글셀 3.7V에서 330밀리암페어시 정도의 용량을 공급하는 것으로 추정된다. 이것은 총 사용가능 에너지 1.2와트시에 해당한다.

비용 면에서는 새로운 삼성의 프로세서(아마도 Apple사가 5 달러 정도에 소싱했을 것으로 보인다)보다 내부 NAND 플래시 메모리에 더 많은 비용이 든다. 최저 밀도의 2기가바이트급 나노 모델에서 조차도 하이닉스의 HY27UV08AG5M 4칩 스택형 NAND(단일 TSSOP 패키지에 들어 있는)는 20 달러 정도의 비용을 차지하고 있는 것같다. 물론 이는 Apple사에 대한 가격 할인과 계약구매 타이밍에 크게 의존하지만 말이다.

SDRAM의 경우와 비슷하게, NAND 플래시에서도 멀티소싱이 중요하다. Toshiba와 삼성은 둘 다 이 새로운 나노 계열을 위한 NAND 플래시의 추가 공급 업체들로 알려져 있다. 이 제품은 TSSOP 패키지의 스택들을 사용하여 8기가바이트의 보다 큰 메모리를 갖추고 있는데, 이 패키지들 각각은 내부에 독자적인 멀티다이 스택들을 포함하고 있다. 시각적 증거와 Staktek사가 공개적으로 제공한 정보를 토대로 해볼 때, Toshiba사는 Staktek사의 TSSOP 패키지 스태킹 기술을 사용하고 있는 것같다.

이 모든 것들을 고려해보면, 2기기바이트 용량의 이 2세대 나노 모델은 액세서리(이어폰, USB 케이블 및 도킹 어댑터)를 포함하여 65달러 범위의 직접생산 및 소재 비용을 가질 것으로 추정된다. 보다 고밀도의 NAND 스택 가격을 다소 높이 잡는다면 4기가바이트 및 8기가바이트 버전의 소재 및 생산비는 각각 87달러 및 132달러 범위가 될 것으로 추정할 수 있다. 세 가지 모델들(2기가바이트, 4기가바이트 및 8기가바이트)의 소매가는 150달러, 200달러 및 250달러로서, 총 마진은 좋아보인다. 이는 로엔드의 경우 56퍼센트에서 하이엔드의 경우 47퍼센트에 이른다. 물론 제품 개발, 마케팅, 출하 및 모든 소프트웨어 라이선스와 관련된 다른 간접 비용들은 이 수치에 포함되어 있지 않지만, 어떠한 경우이든 여전히 상황은 상당히 긍정적이다. 보다 고밀도 NAND의 가격이 다소 떨어진다고 해도, 탑엔드 모델의 마진은 보다 신속하게 개선될 것이다.

최신 나노 모델이 이전 모델에 필적하는 인기를 누릴지는 아직 두고 볼 일이다. 소비자들은 아이팟에 다소 싫증을 느낄지도 모르고, 이 제품 라인의 빠른 진화는 구매자들이 잦은 제품 변화 및 업그레이드를 따라올 수 있는 능력을 소진시켜 버릴지도 모른다. 하지만 시장에 대한 그 같은 질문에는 오직 시간만이 대답해 줄 수 있다. 아직까지는 Apple사가 멋진 디자인에다가 수익성도 높아 보이는 또 다른 아이팟 모델들을 가지고 여전히 오디오 플레이어 시장을 지배하고 있다.

Apple사에서는 기계 재설계와 함께 이 제품의 공급 체인도 크게 변경했지만, 선택된 설계 요소들은 상당 부분 그대로 놔두었다.

Apple사에서는 기계 재설계와 함께 이 제품의 공급 체인도 크게 변경했지만, 선택된 설계 요소들은 상당 부분 그대로 놔두었다.


본 기사는
http://www.eetkorea.com/ART_8800447831_480303_c76a4ab2200701.HTM 에 있는 전자 엔지니어 기사에서 인쇄한 것입니다.

Emailing: Programmable Logic DesignLine | How to maximize FPGA performance

http://www.pldesignline.com/196900804




January 15, 2007

How to maximize FPGA performance

The more that can be done upfront with good coding styles, timing constraints definition, and resource planning, the easier it will be for the downstream tools to achieve timing requirements.

Editor's Note: See also the related Product Release Article.

As FPGAs push the envelope of performance, understanding how to design for maximum performance requires knowledge of the device architecture and design software. Today's FPGAs resemble a true System-on-a-Chip (SoC) with many more sophisticated features than the glue logic FPGAs of the past. To maximize system performance, designers need to use proper design techniques such as defining timing constraints and selecting options in synthesis and implementation that work best for their design. This article describes how to achieve faster timing in the fewest design iterations.

Understanding the architecture
When evaluating a new FPGA architecture, it is important to understand the hardware features and the tradeoffs that can be made in the architecture. Datasheets, user guides, and technical papers on the architectural features should be thoroughly reviewed before moving forward with a design.

The first thing to learn about any FPGA is what makes up the basic fabric of logic. For example, each of the configurable logic blocks (CLBs) in a Xilinx Virtex-5 FPGA contains two slices; and each slice contains four 6-input look-up tables (LUTs), four registers, and dedicated carry logic. For maximum utilization of each slice, it is important to take into consideration the width of the LUTs, the connectivity between the basic elements, and any shared resources.

Many FPGA architectures also contain hard IP blocks, such as embedded memory and blocks used for DSP functions. If a hard-IP block continuously shows up as the source or destination of your critical path, there are a couple of things that can be analyzed to improve the performance. First, check to see if the design is making the most of the block's features and that the synthesis tool is inferring the features you expected from your RTL code. Use the dedicated pipeline registers inside the blocks to reduce the setup and clock-to-out timing. Evaluate the tradeoff between using dedicated blocks versus implementing the same function in slices to allow for placement flexibility. This can especially be important when using a high percentage of hard-IP blocks.

The clocking resources that are utilized in a design can also affect a design's performance. For example, Xilinx Virtex-5 FPGAs have I/O, regional, and global clocking resources. These devices are divided into clock regions which at most, can contain 4 regional clocks and 10 global clocks. During design planning, it is important to analyze how many clock regions are going to be used as well as specific clocks within a clock region. Placing your I/Os so that their interface logic does not require all the clock resources in a clock region gives the implementation tools greater placement flexibility.

Define timing requirements
Synthesis and implementation tools are driven by the performance goals that a user specifies with timing constraints. It is important to constrain all internal clock domains, input and output (I/O) paths, multi-cycle paths, and false paths. Define realistic timing constraints in synthesis order to prevent excessive replication.

In your synthesis report, check for any replicated registers and ensure that timing constraints that might apply to the original register also cover the replicated registers for implementation. When writing timing constraints for implementation, group the maximum number of paths with the same timing requirement first before generating a specific timing constraint. By consolidating constraints, implementation runtime and memory usage can be minimized.

Example of non-consolidated constraints (Xilinx constraint syntax)
TIMESPEC "TS_firsttimespec" = FROM "flopa" TO "flopb" 10ns;
TIMESPEC "TS_secondtimespec" = FROM "flopc" TO "flopb" 10ns;
TIMESPEC "TS_thirdtimespec" = FROM "flopd" TO "flopb" 10ns;

Consolidation of constraints using grouping
INST "flopa" TNM = "flopgroup";
INST "flopc" TNM = "flopgroup";
INST "flopd" TNM = "flopgroup";

TIMESPEC "TS_consolidated" = FROM "flopgroup" TO "flopb" 10ns;

Driving synthesis
For a synthesis tool to create a high-performance circuit, the tool needs to be properly driven by the designer. The first thing a designer needs to consider is proper coding techniques to ensure that inference of behavioral RTL made by the synthesis tool leads to the maximum usage of the architectural features. For example, Xilinx ISE Project Navigator's language templates – available in both Verilog and VHDL – are a great place to get coding examples.

Next, make sure that the synthesis tool has a complete picture of the design. If a design contains IP netlists or any other lower level black-boxed netlists, these netlists should be included in the synthesis project. Although the synthesis tool won't optimize any logic within the netlist, it will have a better understanding of how to optimize the HDL that interfaces to these lower level netlists.

The tool also needs to understand the performance goals of a design using the timing constraints supplied by the designer. If there are critical paths in the implementation that are not seen as critical in synthesis, try Synplicity Synplify PRO's –route constraint to force synthesis to focus on that path. Finally, there are a variety of tool settings in synthesis that should be explored. Refer to Fig 1 for suggested tool settings for Synplify PRO.


1. Suggested tool settings for Synplify PRO.
It is important to start off with a baseline set of tool options and incrementally add new switches to understand the effects. Also note there are a variety of attribute settings that can affect how inference of logic is done and synthesis is optimized. These attributes are an easy way to affect synthesis with out having to re-code (see Table 1)


Table 1. Helpful Synthesis Attributes.*

* For a complete listing of attributes and their functionality, please see the synthesis tool's documentation.

Although timing performance might be enhanced, options that do lead to the replication of logic such as retiming in Synplify PRO can impact area. If the design is affected by high-fanout nets and you want the synthesis tool to reduce that fanout, use fanout attributes specifically on that specific net, versus globally specifying a maximum fanout limit. If hierarchical boundaries are maintained, a designer should make sure that ports are registered at the hierarchical boundaries. If critical paths cross over these hierarchical boundaries, certain optimizations will not be allowed by the synthesis tool. This can lead both to lower performance and higher area utilization. Before moving on to implementation, it is always important to review the warnings in the synthesis report. It is also beneficial to check the RTL schematic view for how the synthesis tool is interpreting the HDL and the technology schematic to understand how the HDL is mapping to the specific FPGA architecture.

Choosing implementation options
Having obtained an acceptable timing estimate from the synthesis tool, use the implementation tools to determine the true performance of the design. The implementation options that can be used are unique for each design depending on the performance goals of the design, the synthesis flow used, and its overall structure. Once the majority of the functionality is defined in the design's HDL and the effort is focused on timing closure, it is beneficial to run a series of different implementations with different sets of options to determine which is the best combination for the design.

ISE Xplorer is an example of a tool that will allow a designer to determine which options work best. ISE Xplorer has been tuned for each Xilinx FPGA architecture to try the best set of combinations. Although initial runtime can be longer because multiple implementations need to be run, once the design has the right set of options, it will likely reduce the number of design iterations to achieve timing closure.

Physical synthesis options in implementation can be used to re-optimize and pack logic based on knowledge of the critical paths of a design, leading to better placement and routing. Note that physical synthesis can lead to increased area due to replication of logic. Like synthesis, if hierarchy is maintained on a design but the critical path crosses those hierarchical boundaries, physical synthesis will not be able to optimize that path and potentially, inefficient packing will occur. To evaluate whether keeping hierarchy is affecting the performance of the design, turn off hierarchy preservation with an attribute or option during implementation. If it does prove to have an impact, reconsider how the hierarchical boundaries are defined.

Evaluating critical paths
By understanding the characteristics of the critical path, a designer can make better decisions on what to do for the next design iteration. A data path is comprised of both logic and interconnect delay. Individual component delays that make up logic delay are fixed. Logic delay can only be reduced if the number of logic levels are reduced or the structure of the logic is changed. By comparison, interconnect delay is much more variable and is dependent on the placement of the logic, routing congestion, and the competition between nets for the fastest routing resources. Before routing the design a quick timing analysis after placement is recommended. Although this timing report will only have estimates for the routing delays, it will give an idea of the critical paths the implementation tools are working on. If the critical paths have a high number of logic levels, designers may want to work on improving the logic levels versus running it through PAR. When the design has an excessive amount of logic levels that lead to many routing interconnects:

  1. Try the different physical synthesis options to see if logic levels can be reduced.
  2. Go back to synthesis and verify that critical paths reported in implementation match what is reported in synthesis. If they are not, use constraints like Synplify PRO's –route to have the synthesis tool focus on these paths.
  3. Review the HDL code to ensure that it takes advantage of the hardware.

In the case where there are few logic levels but the certain data paths are not meeting the performance requirement:

  1. Evaluate fan-out on routes with long delay.
  2. If a critical path contains hard-IP blocks such as RAMBs or DSP48Es, verify the design is taking full advantage of the embedded registers. Also understand when to make the tradeoff between using these hard blocks versus using slice logic.
  3. Analyze clock skew. Large clock skew can be caused by inefficient use of the clock resources in the design.
  4. Perform a placement analysis. If logic appears to be placed far apart from each other, floorplanning of critical blocks may be required. Only floorplan where necessary. Over floorplanning will not give as much flexibility to the tool and could lead to worse performance.
  5. If area groups were created for a design with a previous version of software or prior to many design changes, consider removing those area groups to evaluate whether or not they are negatively affecting placement.
  6. Consider placing hard IP blocks such as embedded memory and DSP blocks.

Conclusion
Today's FPGAs have a variety of high performance features. In order to take full advantage of these features, a few things need to be considered. The more that can be done upfront with good coding styles, timing constraints definition, and resource planning, the easier it will be for the downstream tools to achieve timing requirements. It is also equally important to know what to do next when design requirements are not met in first iteration.

Michelle Fernandez is a technical marketing engineer in the Software Product Marketing Group at Xilinx. Based on the analysis of customer designs, Michelle provides recommendations aimed at improving FPGA design performance and ease of use to the development teams at Xilinx. Michelle joined Xilinx in 1999 and has held a variety of positions in customer support and field applications engineering. She holds a bachelor's of science degree in electrical engineering from University of California at Davis. Michelle can be contacted at: michelle.fernandez@xilinx.com.


2007년 1월 15일 월요일

2006년 12월 28일 목요일

FPGA, EDA 위주의 다양한 bookmarks

Source: http://atrak.usc.edu/~changk/links.html

General CAD and VLSI Research Centers

Algorithm Research Centers

Mathematics and Optimization

FPGA related Research Centers

Computer Architecture

Low Power Research  Centers

Reconfigurable Computing

FPGA

Software Defined Radio (SDR)

Embedded Programmable Logic Cores

Digital Signal Processing

On-Chip Cross-talk Modeling

Testing

MATLAB

JAVA

Resources

Lectures

MITOPENCOURSEWARE

Electronic Design Automation

VLSI

Algorithms

Mathematics

Language

Reconfigurable Computing

Computer Architecture

 

CAD Tools

Interesting Industry

News

Element CXI, Inc.

12/28/2006


ElementCXI - Company Overview

http://www.elementcxi.com/overview.htm

Corporate – Company Overview
ElementCXI was founded in April 2004 as the next-generation semiconductor company. It’s founding is based on the realization that the delivery of real integrated circuit (IC) innovation has slowed – Silicon Valley being 40 years old – while the need for and the possibility of true innovation has accelerated in this ever-changing world. The ElementCXI team is combining the best of hardware and software to develop the next, wide-spread, general-purpose computing technologies and needed business models.


ElementCXI has development facilities/offices in Silicon Valley (Milpitas, California); Nashua, New Hampshire; and Tokyo, Japan.

ElementCXI’s Mission
Incorporated into the Company’s name is a constant reminder that customers must have the ability to Continuously Xccelerate (the) Innovation of their products.


ElementCXI’s Focus
Today, ODMs/OEMs everywhere are stifled with increasing electronic complexity, massive integration, slower and more expensive-to-develop applications, elongated time-to-market, decreasing return-on-investment, increased competition, and end-products that are increasingly likely to fail. Meanwhile, the Internet’s instantaneous flood of information and communication allows customers and competitors to immediately spread the word, stopping product sales worldwide if a usage problem occurs. The design effort, manufacture, and deployment of a new product are up against an inversely high-proportional set of risks. ElementCXI is focused on creating a highly advanced, next-generation technology that corrects these complex problems, enabling ODMs/OEMs to quickly and easily develop the best possible solution for their products.


The Need for a New Processing Solution
Despite enormous gains in raw computational power over the last two decades, it becomes increasingly clearer that a new IC approach is necessary to address the requirements of the 21st century. Whether or not the semiconductor industry continues doubling the number of transistors on a chip every 18 months, there continues to be no intelligent means to harness and use today’s raw computing power, and, we are continually defeated by the creation of larger, more complex systems.


Everyone knows the excitement of a new PC wears off quickly as its hard drive fills with complex and unreliable software code –the processor bogs down churning through unknown routines and the Internet allows infiltration of unwanted viruses. The raw computing power that so seductively invited us to build systems of unprecedented size and complexity has lead to products that are difficult to design, debug, monitor, and test. These systems regularly fail in practice, are increasingly vulnerable to unwanted intrusions, and are harder for the end-user to understand and use. These same issues occur in the embedded product space and the OEM is assigned the responsibility of filtering these issues from the end-user.

It’s also becoming apparent that growing system complexity may actually be reversing the information revolution. The cost of programming, building, and maintaining ever-more-complex systems has grown out of control. Finished products have shorter life cycles and decreasing return on investment (ROI), and users are constantly required to increase their technical expertise. The results are systems that grow more rigid, fragile, and unreliable, while end-users and ODMs/OEMs pay more to become more frustrated.

The design challenges that require complex SoCs with millions of lines of code, months to years of design time, and several IC re-spins must now meet market pressures that can no longer afford these costly and lengthy design cycles. A radical change in technology must take place in order to achieve a quantum leap in capability, productivity, and ease-of-use.

The current ICs and architectures that form the basis for Moore’s Law are predicated on the historical requirements of the 3Ps - performance, power consumption, and price. Until recently, it has been possible to largely ignore the dimension of the 3Rs – Robustness (resists a failure), Resilience (recovers despite a hard or soft failure), and true Reliability (continuous operation). As systems become more complex and IC fabrication geometries continue to decline, the 3Rs can no longer be ignored. The 3Rs provide the underpinning for products that are much faster and easier to design and use, have drastically reduced complexity, and that possess a quantum leap in system flexibility, upgradeability, security, and reduced software code – all while maintaining the original 3P requirements.

The attributes of the 3Rs also enable OEMs to Continuously Xccelerate (the) Innovation of their end products while quickly and easily meeting ever changing market demands. Rather than being behind the customers’ demands for new functionality and features, OEMs can supply products that exceed their customers’ desires – whether it’s a single customer or millions of customers.

Market Opportunity
ElementCXI is designing a general purpose processing platform suitable for any processing application. Element CXI’s initial focus is on three market opportunities:

  • Automotive electronics (telematics, communications, engine controllers)
  • Consumer wireless communications (handsets and PDAs)
  • Converging markets of digital imaging and 3D graphics (cameras, video, and analysis).

ElementCXI can then expand into markets as diverse as the following:

  • Consumer electronics (HDTV, digital TV, video compression, broadcast media)
  • Office imaging (digital imaging, digital printing)
  • General telecommunications (telecom infrastructure)
  • Wireless communications (base stations, satellite receivers)
  • Networking (data compression, encryption/decryption)
  • Multi-media (conferencing, video/image scaling)
  • Medical electronics (CAT scan, ultrasound)
  • Instrumentation and industrial test and measurement (robotic vision)
  • Military and security (security, scanning, biometrics)


ElementCXI - Management
http://www.elementcxi.com/management.htm


Management Team
For over 20 years, the founding team and initial employees have been involved in key developments of integrated circuit (IC) fabrication processes, memory design, logic design, electronic design automation (EDA), reconfigurable computing, and IC manufacturing. They have invented and commercialized new fabrication processes, IC architectures, design tools, system OSs, RTOS kernels, and software control of real-time dynamic logic. The team has over 150 years of combined experience in high technology engineering and management, including the design, development, commercialization, marketing, sales, and product introductions of advanced electronic products and services.


Jaime Cummins
Chief Executive Officer and Founder
Jaime Cummins is the CEO and Founder of Element CXI. Mr. Cummins has over twenty years experience leading divisions and groups in the development of emerging wireless and wire-line communication systems, networking products, innovative software, and silicon technology. He most recently was a Co-Founder and former President and Chief Executive Officer (CEO) of QuickSilver Technology. At Xilinx, he was the Senior Director and General Manager of the Reconfigurable Logic Group that developed the XC6200, the first commercial RPU. Prior to Xilinx, Mr. Cummins was the Executive Director of Technology for Pacific Bell Video Services (PBVS) where he led the development and the first commercial deployments of broadband consumer services over a unified voice, data, and video network. At, Apple Computer, Mr. Cummins was Director of Macintosh System Software and was responsible for the development of the Macintosh System 7.5. He also was senior manager in the Macintosh Hardware Division, and Apple Integrated Systems Group. Mr. Cummins was a California State Scholar and holds a B.A. from the University of California at Santa Barbara. He attended the graduate school of Computer Science and Engineering at California State University at Sacramento.


John Watson
Vice President and Founder
John Watson is the Vice Presdient and Founder of Element CXI. Mr. Watson has more than twenty years marketing, sales, and senior management experience at Intel, Fairchild, National Semiconductor, Data I/O, and Xilinx, as well as a strong engineering background that dates back to the formative days of Intel. He was most recently a Co-Founder and Vice President Marketing of QuickSilver Technology, the pioneering company of adaptive computing technology. Mr. Watson’s focus is on innovating and delivering industry-first, leading-edge products throughout United States, Europe, and Southeast Asia/Japan geographies. While at QuickSilver, Mr. Watson was a co-developer of the Adaptive Computing Machine (ACM), a new class of high performance/low power IC, and developed the market for this technology. At Xilinx, he was responsible for developing and establishing the market category of reconfigurable computing, using Xilinx FPGA-based technologies. During is career at Data I/O, he played a key role in developing the market for and acceptance of FPGA technologies in 1989, as well as developing the world’s first FPGA emulator and software design tools Mr. Watson has been a co-founder of several industry tradeshows, magazines, and trade associations, promoting the advancement of IC technologies. He holds a BSEE from the University of Portland.


Robert (Bob) Barker
Director of Business Development
Robert Barker heads Business Development at Element CXI. Mr. Barker has over 20 years experience as a senior-level manager in the semiconductor, software and distribution industry. He held the position of Vice President of Marketing at Exemplar Logic, where he was responsible for the successful repositioning of the company from an OEM niche technology supplier to a mainstream FPGA synthesis end-user supplier. At Exemplar Logic, he introduced the highly successful Leonardo series of synthesis tools to the market, which contributed year-to-year revenue growth rates of 70 to 100 percent over a four-year period of time. Market valuation of Exemplar increased from $25M to $120M in two years. Prior to this, Mr. Barker was the Director of Marketing for the PLD Products Business Unit for Xilinx. At Plus Logic, an FPGA start-up, Mr. Barker participated in the initial funding of the company as a member of the management team that raised $5M in initial capital. He went on to found Plus Logic’s European subsidiary in Munich, Germany. Early in his career, Mr. Barker held marketing and sales positions at Hamilton/Avnet, Signetics, Intersil, and Mesa Engineering. He holds a BSEE from California Polytechnic State University.


Chris Phillips
VP of Engineering
Mr. Phillips has an extensive 20 year expertise in systems applications, micro-architectures, logic design, silicon level circuit design, algorithm invention, high level/assembly language programming, and code scripts. He has brought to market 20 fully-functional-at-first-silicon device tape outs and has 23 patents in the design of microcontrollers, microprocessors, FPGAs, ASICs, reconfigurable computing systems and CAD EDA tools. Previous to ElementCXI, he co-founded Tiger Semiconductor, Leopard Logic, and Chameleon Systems . At Summitt Design, Mr Phillips was Director of High Level Synthesis and at DaSys Inc. he pioneering behavioral synthesis. At Crosspoint Solutions, Mr. Phillips served as Director of Advanced Architecture for the CrossFire FPGA family and at National Semiconductor he designed and delivered the control and decode logic for a fully compatible, clean room 486 processor producing functional silicon and 8 patents in 15 months. Earlier, he was the designer responsible for the COP444C micro-controller which then averaged $80M/year revenue for 17 years so that, on average, every person in the US owns at least three of these devices. Chris Phillips graduated with a Bachelor of Science degree in Electrical Engineering from Cornell University in Ithaca , New York ; McMullen Scholar.


Dr. Sam Beal
Director of Applications
Sam has 26 years experience in engineering and marketing of semiconductor products, encompassing CMOS process and design, ASIC methodology and design services, FPGA applications and product planning, and system in package (SiP) development. As Senior Member of the Technical Staff, he developed Texas Instruments' initial standard cell methodology and later established and managed TI's first ASIC design center. He built and managed teams responsible for applications engineering, technical marketing, product marketing, and 3rd party IP at Hitachi , Actel and Alpine Microsystems. Sam has 6 patents granted, 4 pending, 25+ published articles and numerous conference presentations throughout the US , Europe and Japan. He holds a Ph.D in EE from SMU, Dallas Tx.


Dale Wong
Director of Software development
Prior to Element CXI, Dale Wong was a founder, V.P. of Technology for Leopard Logic, a
start-up company dedicated to the realization of data intensive algorithms in silicon. There he was responsible for global technology strategy and achievement of commercial quality results. Dale was also a founding member of Chameleon Systems from 1997-2000, where he was VP of Software development for ground-breaking development of the world’s first commercial reconfigurable communications platform. Mr. Wong received key seminal patents in the application of dynamic adaptive reconfigurability for algorithm acceleration. Dale has written and directed key platforms in both start-up and large corporate development environments at companies such as VLSI Technology, Crosspoint Solutions, and Cadence Design Automation in senior contributory roles. Mr. Wong has received 16 USPTO patents in area’s of advanced algorithm application and design.


© Copyright 2005-2006, Element CXI, Inc. All rights reserved.

2006년 12월 27일 수요일

Emailing: "라우팅 및 원격 액세스" "이름 확인" - Google 검색

The message is ready to be sent with the following file or link attachments:
Shortcut to:
http://www.google.co.kr/search?num=100&hl=ko&newwindow=1&rls=GGLD%2CGGLD%3A2005-25%2CGGLD%3Ako&q=%22%EB%9D%BC%EC%9A%B0%ED%8C%85+%EB%B0%8F+%EC%9B%90%EA%B2%A9+%EC%95%A1%EC%84%B8%EC%8A%A4%22+%22%EC%9D%B4%EB%A6%84+%ED%99%95%EC%9D%B8%22&btnG=%EA%B2%80%EC%83%89&lr=lang_ko

Note: To protect against computer viruses, e-mail programs may prevent sending or receiving certain types of file attachments. Check your e-mail security settings to determine how attachments are handled.

Adeurian D. Sapienneu :: 윈도우 구동 서비스와 포트번호

The message is ready to be sent with the following file or link attachments:
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2006년 12월 20일 수요일

갈수록 교묘해지는 e메일 스팸 - e메일 스팸도 ‘2.0시대’를 맞았다.

갈수록 교묘해지는 e메일 스팸

e메일 스팸도 ‘2.0시대’를 맞았다.

스팸메일이 여전히 기승을 부리고 있는 가운데 날로 첨단화하는 안티 스팸 기술에 대응해 스팸 발송 기술도 진화를 거듭하고 있는 것으로 나타났다.

뉴욕타임스는 스팸메일 필터 업체 아이언포트 자료를 인용해 지난해 말 기점으로 스팸메일 건수가 다시 늘고, 발송 기법 또한 교묘해졌다고 소개했다. 특히 기존 스팸 필터를 무력화할 수 있는 첨단 기술로 무장한 스팸메일인 스팸 2.0이 잇따라 출현 중이라고 전했다.

스팸 2.0은 기존 필터 기술을 교묘하게 피할 수 있는 신종 스팸메일. 기존 스팸 차단 기술은 크게 메일 발송자를 분석해 추적하거나, 텍스트에 포함된 단어로 메일을 걸러내고 연결된 웹사이트 검색를 통해 스팸메일 여부를 파악하는 등 3가지 방법을 사용했다.

스팸2.0은 한 마디로 이를 피해 갈 수 있는 새로운 형태의 지능형 메일.

먼저 스패머는 ’봇넷(botnet)’으로 불리는 해킹 프로그램을 사용해 자신의 컴퓨터가 아닌 다른 컴퓨터에서 스팸메일을 발송하는 방법을 쓰고 있다. 또 특정 문구를 걸러 내는 메일 텍스트 분석을 피하기 위해 이미지 속에 광고 문안을 넣어 만든 ‘이미지 스팸’ 형태로 진화하는 상황이다.

아이언포트는 이미지 스팸 발송량이 매년 크게 증가해 전체 스팸메일 중 최고 45%까지 차지하고 있다고 집계했다. 또 스팸메일 필터가 스팸메일 복사본을 찾아내 차단하지 못하도록 이미지를 조금씩 변경하는 스팸 기술까지 등장했다.

콕스커뮤니케이션스 전산 담당자인 프랭클린 왈릭은 “올해 들어서 기존 필터에 걸러지지 않는 스팸메일이 쏟아지고 있다”며 “내부에서 스팸메일 필터를 이제 사용하지 않고 있냐는 질문을 받을 정도”라고 말했다.

특히 신종 스팸메일은 미국 뿐 아니라 유럽·아시아·아프리카 등에서 무차별적으로 발송되고 있으며 지난 6개월 동안 크게 증가해 e메일 10통 가운데 9통이 스팸메일일 정도로 극성을 부리고 있다.

강병준 기자

[전자신문 2006-12-08]
 출처 : 전자신문 [2006/12/08 ]
 
 

2006년 12월 12일 화요일

사이커넥트, 디지털 전력선 트랜시버 칩 개발

사이커넥트, 디지털 전력선 트랜시버 칩 개발
게재: 2006년 12월 01일

사이커넥트의 디지털 전력선 트랜시버 칩 PLT050

사이커넥트(SiConnect)가 자사 최초의 디지털 전력선 트랜시버 칩 PLT050을 개발했다고 밝혔다.

ADSL 속도를 지원할 수 있도록 설계된 PLT050은 헤드라인 대역폭이 85Mbps 정도인 경쟁 솔루션의 성능과 맞먹는 14Mbps의 페이로드 쓰루풋(실제)을 달성한다.

양방향 아날로그/디지털 인터페이스 IC(AD9865), 단순한 커플러 회로, 산업 표준 PHY(이더넷, USB 또는 직렬) 및 시스템 펌웨어 및 구성 업로드를 위한 512kbit EEPROM 와 함께 사용되는 이 칩은 최소한의 외부 부품만으로도 완벽한 전력선 트랜시버 솔루션을 구현할 수 있다.

대체 전력선 트랜시버 솔루션과는 달리 POEM 기술 기반의 PLT050은 SMA/CR(Synchronous Multiple Access / Contention Resolution) 프로토콜과 16 서비스 레벨의 QoS 관리 기술을 이용해 오디오, 비디오, VoIP 및 IP 데이터 스트림간의 공정하고 우선적인 분배를 보장한다.

중요한 것은 PLT050을 이용하면, FCC Part 15, CISPR 22와 이의 유럽 지침인 EN55022(유럽에서 판매되는 가전에 요구되는 필수지침)를 포함해 글로벌 EMC 지침을 준수하는 제품을 만들 수 있다는 것이다.


http://www.eetkorea.com/ART_8800444059_839577_bbf54982200612.HTM

자일링스, 마이크로블레이즈 개발 킷 출시

자일링스, 마이크로블레이즈 개발 킷 출시
게재: 2006년 11월 28일

마이크로블레이즈 개발 킷 ‘스파르탄-3E 1600E 에디션’

자일링스가 마이크로블레이즈(MicroBlaze) 개발 킷 ‘스파르탄-3E(Spartan-3E) 1600E 에디션’을 발표했다. 스파르탄-3E 1600E 에디션은 개발 과정을 시작하는데 필요한 하드웨어, 디자인 툴, 지적 재산권(IP), 레퍼런스 디자인을 모두 포함하는 통합 플랫폼을 제공한다.

통합 마이크로블레이즈 임베디드 개발 킷과 저렴한 스파르탄-3E플랫폼을 기반으로 하드웨어 및 소프트웨어 개발을 신속하게 실행할 수 있으며, 그 결과 저렴한 임베디드 솔루션의 개발을 가속화할 수 있다고 자일링스는 밝혔다.

마이크로블레이즈 개발 킷 '스파르탄-3E 1600E 에디션'은 자일링스 스파르탄-3E 시리즈 플랫폼 FPGA상에서 변화하는 임베디드 디자인 조건에 맞게 플랫폼을 조정할 수 있는 유연한 32비트 마이크로블레이즈 소프트 프로세서를 포함하고 있다.

개발 킷에 포함된 스파르탄-3E SP3E1600E 개발 보드는 플랫폼 로직, DSP 코프로세싱, 임베디드 시스템 통합 성능을 지닌 스파르탄-3E XC3S1600E-4FG320C 디바이스로, 설계자들이 간편하고 저비용으로 임베디드 시스템 디자인을 프로토타입 및 평가할 수 있도록 부품, 메모리, 디스플레이, 커넥터, 인터페이스의 다양한 옵션을 내장한다.


출처: http://www.eetkorea.com/ART_8800443316_839575_e94537f9200611.HTM